Chien-Wen Tsi

Title: Innovations of Chien-Wen Tsi

Introduction

Chien-Wen Tsi is a notable inventor based in Hukou, Taiwan. He has made significant contributions to the field of microelectronics, particularly through his innovative patents. With a total of 2 patents, Tsi has demonstrated his expertise and creativity in developing advanced technologies.

Latest Patents

One of Chien-Wen Tsi's latest patents focuses on a bumping process and bump structure. This process involves forming a passivation layer with a planarized surface that covers a pad on a substrate. It includes creating a hole that penetrates through the passivation layer to expose the contact surface of the pad. A bump is then formed on both the contact surface and the planarized surface. The planarized surface provides a larger effective area for pressing, which minimizes the pad and enhances the mechanical strength at the pad's periphery. This innovation offers more selection flexibility for anisotropic conductive film, reduces the chances of short circuits and current leakage within the bump gap, and ultimately increases the yield of the pressing process and the conductive quality of the bump.

Career Highlights

Chien-Wen Tsi is currently associated with Elan Microelectronics Corporation, where he continues to push the boundaries of technology. His work has been instrumental in advancing the capabilities of microelectronic components.

Collaborations

Tsi has collaborated with several talented individuals in his field, including Chun-Ping Hu and Cheng-Chung Chen. These collaborations have fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies.

Conclusion

Chien-Wen Tsi's contributions to the field of microelectronics through his patents and collaborations highlight his role as a significant inventor. His innovative approaches continue to influence the industry and pave the way for future advancements.