Chun Mu

Title: Innovations by Inventor Chun Mu

Introduction

Chun Mu is a notable inventor based in Saratoga, California, with a remarkable portfolio of seven patents. His work primarily focuses on advancements in microelectronic packaging technologies, which are crucial for the development of modern electronic devices.

Latest Patents

Chun Mu's latest patents include a process for forming a direct build-up layer on encapsulated die packages utilizing intermediate structures. This innovative method involves fabricating microelectronic dice by creating first and second encapsulated die assemblies, each containing at least one microelectronic die within a packaging material. The encapsulated die assemblies are arranged back surface-to-back, allowing for simultaneous formation of build-up layers on their active surfaces. Additionally, he has developed an integrated core microelectronic package that features a microelectronic die within an opening in a microelectronic packaging core, with encapsulation material filling the remaining space. This design allows for the fabrication of dielectric materials and conductive traces on the microelectronic die and the package core.

Career Highlights

Chun Mu has made significant contributions to the field of microelectronics during his tenure at Intel Corporation. His innovative approaches have led to advancements that enhance the performance and reliability of microelectronic packages.

Collaborations

Chun Mu has collaborated with talented coworkers, including Qing Ma and Jian Li, who have contributed to his projects and innovations.

Conclusion

Chun Mu's work exemplifies the spirit of innovation in the microelectronics industry. His patents and contributions continue to shape the future of electronic packaging technologies.