Zhongli, Taiwan

Chun-Ming Yeh

This inventor holds 1 USPTO granted patent. Top assignee: Chung-Shan Institute of Science and Technology. Active years: 2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Ming Yeh. Retrieved from https://idiyas.com/inventor/chun-ming-yeh-huhjl74e

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Chun-Ming Yeh: Inventor in Polymer and Dendron Technology.

Introduction

Chun-Ming Yeh is an inventor associated with Zhongli, Taiwan. His work includes research into dendrons, polyurethane materials, and methods for producing polymer structures.

Latest Patents

Yeh is credited with 1 patent, titled “Dendron, Polyurethane with Side-Chain Regular Dendron, and Producing Methods Thereof.” The patent describes step-by-step methods for producing dendrons of different generations with hydrophobic functional end-groups, as well as polyurethanes containing side-chain dendrons. The end-groups may be long alkyl chains or perfluoroalkyl derivatives. The disclosure also describes honeycomb-like thin films formed through a breath-figure process.

Career Highlights

Yeh is associated with the Chung-Shan Institute of Science and Technology. His patent focuses on dendritic side-chain polyurethanes and the formation of structured thin films, combining polymer synthesis with material design.

Collaborations

Yeh’s listed coworkers include Sheng-hong Dai and Chia-Cheng Chang.

Conclusion

Chun-Ming Yeh’s patent work highlights methods for creating dendron-based polyurethanes and honeycomb-like films, reflecting his contributions to polymer and materials innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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