Company Filing History:
Years Active: 2023
Title: Innovations of Chun-Ming Yeh in Self-Healing Technologies.
Introduction: Chun-Ming Yeh is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of self-healing compositions. His innovative work has the potential to revolutionize various applications in industries requiring durable and resilient materials.
Latest Patents: Chun-Ming Yeh holds a patent for a "Method for manufacturing self-healing composition, self-healing composition, and self-healing film." This patent describes a method of preparing a self-healing composition that involves several steps. The process includes providing an isocyanate solution, a dihydric alcohol solution, and a metal salt solution. The dihydric alcohol contains heterocyclic structures. By mixing the isocyanate solution and the dihydric alcohol solution, polymerization occurs, resulting in a polymer precursor that consists of both hard and soft segments. The hard segment contains urethane groups, while the soft segment includes heterocyclic structures. The subsequent mixing of the polymer precursor with the metal salt solution leads to a chelation reaction, forming a coordination complex and ultimately resulting in the self-healing composition.
Career Highlights: Chun-Ming Yeh is associated with Zhen Ding Technology Co., Ltd., where he continues to innovate and develop advanced materials. His work in self-healing technologies showcases his expertise and commitment to enhancing material performance.
Collaborations: Throughout his career, Chun-Ming Yeh has collaborated with talented individuals such as Chi-Fei Huang and Ho-Hsiu Chou. These collaborations have contributed to the advancement of his research and the successful development of innovative solutions.
Conclusion: Chun-Ming Yeh's contributions to the field of self-healing materials highlight his role as a leading inventor in this area. His patented methods and compositions pave the way for future advancements in durable materials.