Company Filing History:
Years Active: 2009
Title: Innovations of Chun-Ming Liao in Semiconductor Technology
Introduction
Chun-Ming Liao is a notable inventor based in Taichung Hsien, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of heat dissipation. His innovative designs have the potential to enhance the performance and reliability of semiconductor devices.
Latest Patents
Chun-Ming Liao holds a patent for a heat dissipation semiconductor package. This invention includes a chip carrier, a semiconductor chip, a heat conductive adhesive, a heat dissipation member, and an encapsulant. The semiconductor chip is flip-chip mounted on the chip carrier and is defined with a heat conductive adhesive mounting area. The periphery of the heat adhesive mounting area is spaced apart from the edge of the semiconductor chip. The heat dissipation member is mounted on the heat conductive adhesive formed in the heat conductive adhesive mounting area. The encapsulant formed between the chip carrier and the heat dissipation member encapsulates the semiconductor chip and the heat conductive adhesive, embedding edges of the active surface, non-active surface, and side edge of the semiconductor chip. This design increases the bonding area between the encapsulant and the semiconductor chip. Additionally, the side edges of the heat conductive adhesive and the semiconductor chip are not flush with each other, which helps prevent the propagation of delamination.
Career Highlights
Chun-Ming Liao is currently associated with Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor packaging industry. His work has contributed to advancements in semiconductor technology, particularly in improving heat dissipation methods.
Collaborations
Chun-Ming Liao has collaborated with notable colleagues such as Chien-Ping Huang and Ho-Yi Tsai. Their combined expertise has fostered innovation and development in semiconductor packaging solutions.
Conclusion
Chun-Ming Liao's contributions to semiconductor technology, particularly through his patented heat dissipation semiconductor package, highlight his role as an influential inventor in the field. His work continues to impact the efficiency and reliability of semiconductor devices.