Hsinchu, Taiwan

Chun-Ming Lai

This inventor holds 2 USPTO granted patents. Top assignee: Mediatek Corporation. Active years: 2015-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Ming Lai. Retrieved from https://idiyas.com/inventor/chun-ming-lai-he2wt7la

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.7

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Hsinchu, TW (2015)
  • Hsinchu County, TW (2018)

Company Filing History:


Years Active: 2015-2018

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2 patents (USPTO):Explore Patents

Title: Chun-Ming Lai: Pioneering Inventor from Hsinchu County

Introduction: Chun-Ming Lai is a distinguished inventor hailing from the vibrant innovation hub of Hsinchu County, Taiwan. With a passion for technological advancements, he has made significant contributions to the field of patents and inventions.

Latest Patents: Chun-Ming Lai's latest patents focus on cutting-edge technologies in the semiconductor industry, particularly in the development of advanced microchips and integrated circuits. His innovative solutions have garnered attention for their efficiency and reliability.

Career Highlights: Throughout his illustrious career, Chun-Ming Lai has been instrumental in revolutionizing the semiconductor sector with his groundbreaking inventions. His work has not only enhanced the performance of electronic devices but has also set new standards for the industry as a whole.

Collaborations: Chun-Ming Lai has collaborated with leading tech companies and research institutions to further his innovative projects. His partnerships have been crucial in bringing his visionary ideas to life and ensuring their successful implementation in real-world applications.

Conclusion: Chun-Ming Lai's relentless pursuit of innovation and his unwavering commitment to excellence have established him as a trailblazer in the field of inventions. His remarkable achievements continue to inspire aspiring inventors and shape the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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