Chun-Min Lin

Title: Innovations of Chun-Min Lin in Semiconductor Technology

Introduction

Chun-Min Lin is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.

Latest Patents

Chun-Min Lin holds a patent for a semiconductor package structure and method for manufacturing the same. This patent describes a semiconductor package structure that includes a first package with a bonding region and a periphery region surrounding the bonding region. It features at least one insulating structure located in the bonding region of the first package, a second package positioned over the first package and the insulating structure, and a plurality of connectors that provide electrical connections between the two packages. The insulating structure penetrates the first package and is spaced apart from the connectors, showcasing a unique design that enhances semiconductor functionality. He has 1 patent to his name.

Career Highlights

Chun-Min Lin is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work focuses on advancing semiconductor packaging technologies, which are crucial for the performance and reliability of electronic devices.

Collaborations

Chun-Min Lin has collaborated with notable colleagues in his field, including Chih-Hao Lin and Chien-Kuo Chang. These collaborations have contributed to the development of innovative solutions in semiconductor technology.

Conclusion

Chun-Min Lin's contributions to semiconductor technology through his patent and work at Taiwan Semiconductor Manufacturing Company Limited highlight his role as an influential inventor in the industry. His innovative approaches continue to shape the future of semiconductor packaging.