Company Filing History:
Years Active: 2001-2002
Title: Innovations by Chun-Liang Chen
Introduction
Chun-Liang Chen is a notable inventor based in Pingtung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative methods. His work focuses on enhancing the efficiency and cost-effectiveness of chip packaging technologies.
Latest Patents
Chun-Liang Chen's latest patents include a method for fabricating a dual-chip package and a method for wire bonding a chip to a substrate with recessed bond pads. The first patent describes a novel approach to forming a back-to-back dual-chip package. In this method, a first IC chip is bonded to the inactive surface of a second IC chip, with solder balls placed on the active surfaces of both chips. This design allows for a high-density device to be achieved at a low cost by utilizing existing chip designs. The second patent outlines a method for forming chip scale packages using a wire bonding technique and an interposer board with recessed peripheral regions. This innovation addresses the wire sweep problem commonly encountered in the plastic encapsulation process.
Career Highlights
Chun-Liang Chen is currently employed at Vanguard International Semiconductor Corporation, where he continues to develop cutting-edge technologies in semiconductor packaging. His work has contributed to advancements in the efficiency and performance of integrated circuits.
Collaborations
Chun-Liang Chen collaborates with talented coworkers, including Tsung-Chieh Chen and Kuang-Ho Liao. Their combined expertise fosters a creative environment that drives innovation in their projects.
Conclusion
Chun-Liang Chen's contributions to semiconductor packaging through his innovative patents demonstrate his commitment to advancing technology in this field. His work not only enhances device performance but also reduces costs, making significant strides in the industry.