The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2001
Filed:
May. 06, 1999
Vanguard International Semiconductor Corporation, Hsinchu, TW;
Abstract
A method for forming chip scale packages and devices formed by utilizing a wire bonding technique and an interposer board which has recessed peripheral regions are disclosed. In the method, an IC die is bonded on its active surface to an interposer which is constructed with a recessed peripheral regions equipped with interconnections such that shorter bond wires may be run between the IC die and the interposer. The interposer is further equipped, in a top planar surface, with a plurality of interconnections for the subsequently forming of solder balls for connecting to an outside circuit such as a printed circuit board. The present invention novel method further provides the benefit that the shorter wire bonds formed alleviate the wire sweep problem normally occurs in the plastic encapsulation process for such a package.