Yunlin Hsien, Taiwan

Chun-Kun Wu


Average Co-Inventor Count = 5.6

ph-index = 2

Forward Citations = 8(Granted Patents)


Location History:

  • Yun Lin, TW (2004 - 2005)
  • Yun Lin Hsien, TW (2006)

Company Filing History:


Years Active: 2004-2006

Loading Chart...
3 patents (USPTO):Explore Patents

Title: Innovations of Chun-Kun Wu

Introduction

Chun-Kun Wu is a notable inventor based in Yunlin Hsien, Taiwan. He has made significant contributions to the field of capacitive technology, holding a total of 3 patents. His work focuses on enhancing the performance and precision of capacitive printed circuit boards (PCBs).

Latest Patents

One of his latest patents is titled "Capacitive apparatus and manufacturing method for a built-in capacitor with a non-symmetrical electrode." This invention describes an intermediate for use in a capacitive PCB, aimed at reducing inaccuracies in error compression alignment on laminates. The invention utilizes a variety of differently sized metal laminates stacked together to create a high-precision built-in capacitor PCB. This innovation enhances the noise immunity of capacitive PCBs, making them suitable for high-frequency and high-speed modules and systems. It also provides precise capacitance for compact circuit designs that require high-precision capacitance in the future.

Another significant patent is the "Embedded microelectronic capacitor incorporating ground shielding layers and method for fabrication." This invention features an embedded microelectronic capacitor that includes at least one ground shielding layer. It consists of an upper ground shielding layer with an aperture, an electrode plate spaced apart from this layer, and additional ground shielding layers positioned strategically to ensure effective electrical communication without shorting. The design incorporates dielectric materials to enhance performance.

Career Highlights

Chun-Kun Wu is affiliated with the Industrial Technology Research Institute, where he continues to innovate and develop advanced technologies in the field of electronics. His work has been instrumental in pushing the boundaries of capacitive technology.

Collaborations

He has collaborated with notable colleagues, including Ching-Liang Weng and Chang-Sheng Chen, contributing to various projects and advancements in their field.

Conclusion

Chun-Kun Wu's contributions to capacitive technology through his innovative patents demonstrate his commitment to advancing electronic design and functionality. His work continues to influence the industry and pave the way for future innovations.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…