Chun-Kai Mao

Title: Innovations of Chun-Kai Mao in Micro-Electro-Mechanical Systems

Introduction

Chun-Kai Mao is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of micro-electro-mechanical systems (MEMS), holding a total of five patents. His work focuses on innovative structures that enhance the functionality and efficiency of MEMS technology.

Latest Patents

Chun-Kai Mao's latest patents include a unique MEMS structure that features a substrate with an opening portion and a backplate equipped with acoustic holes. This design incorporates a diaphragm positioned between the substrate and the backplate, extending across the opening. The diaphragm is designed with a ventilation hole, creating an air gap between it and the backplate. Additionally, a protrusion extends into this air gap, further enhancing the structure's capabilities. Another notable patent describes a MEMS structure that includes a diaphragm with both outer and inner ventilation holes arranged in a concentric manner. This innovative design prevents electrical connection between the diaphragm and the backplate through the use of a pillar.

Career Highlights

Throughout his career, Chun-Kai Mao has worked with notable companies such as Fortemedia, Inc. and the Industrial Technology Research Institute. His experience in these organizations has allowed him to refine his expertise in MEMS technology and contribute to various advancements in the field.

Collaborations

Chun-Kai Mao has collaborated with esteemed colleagues, including Jien-Ming Chen and Chih-Yuan Chen. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Chun-Kai Mao's contributions to the field of micro-electro-mechanical systems are noteworthy and reflect his dedication to innovation. His patents demonstrate a commitment to advancing technology and improving the functionality of MEMS structures.