Chun-jen Cheng

Title: Innovations of Chun-jen Cheng

Introduction

Chun-jen Cheng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging. His innovative work has led to the development of a unique package structure that enhances the performance and reliability of semiconductor devices.

Latest Patents

Chun-jen Cheng holds a patent for a "Package structure having second adhesive between side surface of semiconductor package and first adhesive." This patent describes a package structure and a method for fabricating the same. The package structure includes a substrate, a semiconductor package, a first adhesive, and a second adhesive. The substrate features a first board surface and a second board surface, with a second region surrounding a first region on the first board surface. The semiconductor package is positioned on the first board surface, and the first adhesive is applied in specific regions. The second adhesive is strategically placed between the side surface and the first adhesive, forming a pier adhesive that enhances the overall integrity of the package.

Career Highlights

Chun-jen Cheng is associated with Wistron Neweb Corporation, where he continues to innovate in the semiconductor field. His work has been instrumental in advancing packaging technologies that are crucial for modern electronic devices.

Collaborations

Chun-jen Cheng has collaborated with notable colleagues such as Kuo-hua Hsieh and Chao-Chieh Chan. Their combined expertise has contributed to the successful development of innovative solutions in semiconductor packaging.

Conclusion

Chun-jen Cheng's contributions to semiconductor packaging through his patent and collaborative efforts highlight his role as a key innovator in the industry. His work continues to influence advancements in technology and improve the performance of electronic devices.