This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Ic Packaging Corporation. Active years: 2007.
Company Filing History:
Years Active: 2007
Title: The Innovations of Chun-I Kao
Introduction
Chun-I Kao is a notable inventor based in Kaohsiung Hsien, Taiwan. He has made significant contributions to the field of sensor technology, particularly with his innovative designs and methods. His work has led to the development of a unique contact sensor that showcases his expertise and creativity.
Latest Patents
Chun-I Kao holds a patent for a "Contact sensor and method for making the same." This invention includes a base with a wall device securely attached to its top face. The wall device features a hole that corresponds to the top contacts, allowing them to be exposed. Additionally, it has a chip receiving space that communicates with the hole. A sensing chip is received in this space, equipped with a sensing area and contacts that connect to the top contacts of the base. A cover encloses the contacts while still allowing the sensing area to be exposed for application. This innovative design enhances the functionality and efficiency of contact sensors.
Career Highlights
Chun-I Kao is associated with Taiwan IC Packaging Corporation, where he continues to develop and refine his inventions. His work at the company has positioned him as a key player in the field of integrated circuit packaging and sensor technology. His dedication to innovation is evident in his patent and ongoing projects.
Collaborations
Chun-I has collaborated with talented individuals such as Ching-Chung Tseng and Chung-Chi Yang. These partnerships have fostered a creative environment that encourages the exchange of ideas and advancements in technology.
Conclusion
Chun-I Kao's contributions to sensor technology through his patent and work at Taiwan IC Packaging Corporation highlight his role as an influential inventor. His innovative designs continue to impact the industry, showcasing the importance of creativity and collaboration in technological advancements.