Company Filing History:
Years Active: 2013-2015
Title: Innovations by Chun Hsien Lin in Semiconductor Packaging
Introduction
Chun Hsien Lin is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on improving the fabrication methods of semiconductor packages, which are crucial for the miniaturization and efficiency of electronic devices.
Latest Patents
Chun Hsien Lin's latest patents include a novel fabrication method of a semiconductor package. This method involves several steps: forming a packaging substrate on a first carrier, bonding a second carrier to the packaging substrate, removing the first carrier, disposing a chip on the packaging substrate, forming an encapsulant on the packaging substrate to encapsulate the chip, and finally removing the second carrier. The innovative use of the first and second carriers provides the thin-type packaging substrate with sufficient rigidity to withstand fabrication processes without cracking or warpage. This advancement meets the miniaturization requirements and significantly improves product yield.
Another patent by Chun Hsien Lin also details a similar fabrication method of a semiconductor package, emphasizing the same steps and benefits. His work in this area is pivotal for enhancing the reliability and performance of semiconductor devices.
Career Highlights
Chun Hsien Lin is currently employed at Siliconware Precision Industries Co., Ltd. His role in the company allows him to apply his innovative ideas and contribute to the advancement of semiconductor technology. His expertise in fabrication methods has positioned him as a key player in the industry.
Collaborations
Chun Hsien Lin collaborates with talented individuals such as Yu Cheng Pai and Ming Chen Sun. Their teamwork fosters an environment of innovation and creativity, leading to groundbreaking advancements in semiconductor packaging.
Conclusion
Chun Hsien Lin's contributions to semiconductor packaging through his patents and collaborations highlight his importance in the field. His innovative methods not only enhance product yield but also support the ongoing trend of miniaturization in technology.