Company Filing History:
Years Active: 2008-2015
Title: The Innovations of Chun-Hsien Lee
Introduction
Chun-Hsien Lee is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of photosensitive resin compositions, holding a total of 3 patents. His work is characterized by innovative approaches to materials that enhance the performance and application of resin compositions.
Latest Patents
Chun-Hsien Lee's latest patents focus on the development of photosensitive resin compositions. One of his patents describes a photosensitive resin composition that includes an alkali-soluble resin, a polysiloxane, an ethylenically unsaturated compound, a photo-initiator, a first solvent, and a black pigment dispersion. The alkali-soluble resin is derived from a mixture that includes an epoxy compound with at least two epoxy groups and a compound with at least one carboxyl group and one ethylenically unsaturated group. The weight ratio of the black pigment dispersion to the polysiloxane ranges from 5 to 35. Another patent elaborates on a similar composition, where the alkali-soluble resin includes an unsaturated-group-containing resin obtained through polymerization of a mixture containing an epoxy compound and a carboxyl group-containing compound. The weight ratio of the unsaturated-group-containing resin to the polysiloxane ranges from 0.1 to 3.0.
Career Highlights
Chun-Hsien Lee is currently employed at Chi Mei Corporation, where he continues to innovate in the field of resin compositions. His work has been instrumental in advancing the applications of photosensitive materials in various industries.
Collaborations
Chun-Hsien Lee has collaborated with notable coworkers such as Hao-Wei Liao and Ching-Yuan Tseng. Their combined expertise contributes to the innovative projects at Chi Mei Corporation.
Conclusion
Chun-Hsien Lee's contributions to the field of photosensitive resin compositions highlight his role as a significant inventor in Taiwan. His innovative patents and collaborations reflect his commitment to advancing material science.