The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 23, 2015

Filed:

Nov. 02, 2012
Applicant:

Chi Mei Corporation, Tainan, TW;

Inventors:

Hao-Wei Liao, Tainan, TW;

Ching-Yuan Tseng, Tainan, TW;

Chun-Hsien Lee, Tainan, TW;

Ming-Ju Wu, Tainan, TW;

Chun-An Shih, Tainan, TW;

Assignee:

Chi Mei Corporation, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 5/23 (2006.01); G03F 7/075 (2006.01); G02B 5/20 (2006.01); G03F 7/027 (2006.01); G02B 5/22 (2006.01); G03C 1/00 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0757 (2013.01); G02B 5/22 (2013.01); G02B 5/201 (2013.01); G03F 7/0007 (2013.01); G03F 7/027 (2013.01);
Abstract

A photosensitive resin composition includes (A) an alkali-soluble resin, (B) a polysiloxane, (C) an ethylenically unsaturated compound, (D) a photo-initiator, (E) a black pigment, and (F) a solvent. The alkali-soluble resin includes an unsaturated-group-containing resin obtained by subjecting a mixture containing (i) an epoxy compound having at least two epoxy groups and (ii) a compound having at least one carboxyl group and at least one ethylenically unsaturated group to polymerization. A weight ratio of the unsaturated-group-containing resin to the polysiloxane ranges from 0.1 to 3.0. Application of the photosensitive resin composition is also disclosed.


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