New Taipei, Taiwan

Chun-Fu Lin

This inventor holds 2 USPTO granted patents. Top assignee: Sinher Technology Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Fu Lin. Retrieved from https://idiyas.com/inventor/chun-fu-lin-6pzveuoc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 3.0


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: The Innovative Mind of Chun-Fu Lin

Introduction

Chun-Fu Lin is a notable inventor based in New Taipei, Taiwan. He has made significant contributions to the field of hinge devices, holding a total of 2 patents. His work reflects a deep understanding of mechanical engineering and innovation.

Latest Patents

Chun-Fu Lin's latest patents include two distinct hinge devices. The first patent describes a hinge device that consists of a base, a first shaft, a second bevel gear, and a second shaft. This design features a first state and a second state, allowing for versatile applications. The second patent also focuses on a hinge device, which includes a base, an arc-shaped mounting member, and two torque components. This design emphasizes movement along tracks and the integration of torque providing components.

Career Highlights

Chun-Fu Lin is currently associated with Sinher Technology Inc., where he continues to innovate and develop new technologies. His expertise in hinge mechanisms has positioned him as a valuable asset in the engineering community.

Collaborations

Chun-Fu Lin has collaborated with talented individuals such as Chih-Huang Peng and Nan-Hai Lai. These partnerships have fostered a creative environment that encourages the development of cutting-edge inventions.

Conclusion

Chun-Fu Lin's contributions to hinge device technology exemplify his innovative spirit and dedication to engineering. His patents not only showcase his technical skills but also his ability to collaborate effectively with others in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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