Hwaseong-si, South Korea

Chun-Deuk Lee


Average Co-Inventor Count = 7.6

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Hwaseong-si, KR (2009 - 2010)
  • Gyeonggi-do, KR (2010)

Company Filing History:


Years Active: 2009-2010

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3 patents (USPTO):Explore Patents

Title: Innovations of Chun-Deuk Lee

Introduction

Chun-Deuk Lee is a notable inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of materials science, particularly in the development of compositions for removing insulation materials. With a total of 3 patents to his name, his work has implications for various industries, including electronics.

Latest Patents

Chun-Deuk Lee's latest patents include a composition for removing an insulation material, a method of removing an insulation layer, and a method of recycling a substrate using the same. One of his compositions is designed to effectively remove insulation materials that include low-k materials and passivation materials. This composition consists of about 5 to 40 percent by weight of a fluorine compound, 0.01 to 20 percent by weight of a first oxidizing agent, 10 to 50 percent by weight of a second oxidizing agent, and the remainder being water. Another patent focuses on a composition that comprises 1 to 50 percent by weight of an oxidizing agent, 0.1 to 35 percent by weight of a fluorine-containing compound, and water, aimed at removing insulation materials.

Career Highlights

Chun-Deuk Lee has worked with prominent companies in the technology sector, including Samsung Electronics Co., Ltd. and Dongwoo Fine-chem Co., Ltd. His experience in these organizations has allowed him to refine his expertise in materials and chemical compositions.

Collaborations

Chun-Deuk Lee has collaborated with notable colleagues in his field, including Dong-Min Kang and Young-Nam Kim. Their joint efforts have contributed to advancements in the technologies related to insulation materials.

Conclusion

Chun-Deuk Lee's innovative work in developing compositions for removing insulation materials showcases his expertise and impact in the field. His patents reflect a commitment to advancing technology and improving processes in the electronics industry.

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