Chun-Chu Wu

Title: Innovations of Chun-Chu Wu in Ceramic Substrate Manufacturing

Introduction

Chun-Chu Wu is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor packaging through his innovative methods in manufacturing ceramic substrates. His work is characterized by a focus on reducing costs while enhancing precision in the production process.

Latest Patents

Chun-Chu Wu holds a patent for a "Method for manufacturing ceramic substrate." This method is distinguished by its use of a preformed trench, a patterned protective layer, and a sand blasting process to create a cavity in a ceramic substrate. The technique allows for precise control over the size and shape of the cavity, which is essential for packaging semiconductor chips. This innovative approach not only lowers manufacturing costs but also increases the accuracy of the ceramic substrate's dimensions.

Career Highlights

Chun-Chu Wu is associated with Viking Tech Corporation, where he applies his expertise in ceramic substrate manufacturing. His work has been instrumental in advancing the technology used in semiconductor packaging, making it more efficient and cost-effective.

Collaborations

Chun-Chu Wu has collaborated with notable colleagues such as Chien-Hung Ho and Chen-Shen Kuo. Their combined efforts contribute to the ongoing advancements in the field of semiconductor technology.

Conclusion

Chun-Chu Wu's innovative methods in ceramic substrate manufacturing exemplify the importance of precision and cost-effectiveness in semiconductor packaging. His contributions continue to influence the industry positively.