The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

Jul. 24, 2015
Applicant:

Viking Tech Corporation, Hsinchu County, TW;

Inventors:

Chien-Hung Ho, Hsinchu County, TW;

Chen-Shen Kuo, Hsinchu County, TW;

Chun-Chu Wu, Hsinchu County, TW;

Assignee:

VIKING TECH CORPORATION, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 31/0203 (2014.01); H01L 21/48 (2006.01); B28B 11/08 (2006.01); B23K 26/38 (2014.01); B24C 1/04 (2006.01); B23K 26/40 (2014.01); H01L 33/64 (2010.01); H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); B23K 26/364 (2015.10); B23K 26/38 (2013.01); B23K 26/402 (2013.01); B24C 1/04 (2013.01); B28B 11/0863 (2013.01); H01L 21/4846 (2013.01); H01L 23/49838 (2013.01); H01L 23/49894 (2013.01); H01L 31/0203 (2013.01); H01L 33/64 (2013.01); B23K 2203/52 (2015.10); H01L 23/24 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/181 (2013.01);
Abstract

A method for manufacturing a ceramic substrate is characterized in using a preformed trench, a patterned protective layer and a sand blasting process to manufacture a cavity in a ceramic substrate and control the cavity size and shape of the ceramic substrate. The ceramic substrate is collocated with a base substrate to form a package substrate for packaging a semiconductor chip. The manufacturing method set forth above can lower the manufacturing cost and raise the accuracy of the size and shape of the cavity of the ceramic substrate. The abovementioned method can reduce the fabrication cost and increase the precision of the shape and size of a ceramic substrate.


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