Taipei, Taiwan

Chun-Chien Lee

This inventor holds 2 USPTO granted patents and 1 published patent application and 2 EPO patents. Top assignee: Giga-Byte Technology Co., Ltd.. Active years: 2020-2021.

USPTO Granted Patents = 2 

% Patents Active = 100.0

 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2020-2021

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2 patents (USPTO):Explore Patents

Title: Innovations by Chun-Chien Lee

Introduction

Chun-Chien Lee is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of technology, particularly in memory modules and motherboard designs. With a total of 2 patents, his work reflects a commitment to advancing electronic components.

Latest Patents

Chun-Chien Lee's latest patents include a memory module with a screen and a fan expansion card with a motherboard module. The memory module with a screen features a memory substrate that includes multiple memory components and a connection interface. It also incorporates a power conversion module and a screen control module, allowing for an innovative display integrated into the memory module. The fan expansion card consists of a first circuit board with at least one fan, designed to enhance airflow through corresponding through-holes, showcasing his focus on improving hardware efficiency.

Career Highlights

Chun-Chien Lee is currently employed at Giga-byte Technology Co., Ltd., a company known for its high-quality computer hardware. His role at Giga-byte has allowed him to work on cutting-edge technology and contribute to the development of advanced electronic products.

Collaborations

He collaborates with talented coworkers, including Hung-Cheng Chen and Tse-Hsien Liao, who share his passion for innovation and technology.

Conclusion

Chun-Chien Lee's contributions to the field of technology through his patents and work at Giga-byte Technology Co., Ltd. highlight his role as an influential inventor. His innovative designs continue to shape the future of electronic components.

Profile summary based on public USPTO records.
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