Chun-Chieh Tseng

Title: Innovator Chun-Chieh Tseng: Pioneering Methods in Metal Pattern Formation

Introduction

Chun-Chieh Tseng, an esteemed inventor located in Taoyuan, Taiwan, has made significant contributions to the field of materials engineering with his innovative methods for forming metal patterns on substrates. With a portfolio of three patents, Tseng's work showcases his commitment to enhancing manufacturing processes in electronics and metallurgy.

Latest Patents

Among Tseng's notable patents, one outlines a "Method for forming a metal pattern on a substrate." This patent discloses techniques involving printing a pattern on a substrate using an ink composition and drying it before subjecting it to an electroless plating solution. The patented ink composition comprises essential components, including a binder, a sulfate terminated polymer, catalytic metal precursors, and polymers deposited with catalytic metal particles. The catalytic metals cited are notable elements such as gold, silver, palladium, platinum, and ruthenium.

Another significant patent focuses on "Metallization on a surface and in through-holes of a substrate." This invention introduces a novel copolymer that is hydrophilic at lower temperatures and transitions to hydrophobic as temperatures increase. The patent explores methods for applying the ink composition onto substrates and forming metal layers through electroless plating, addressing the critical task of creating conductors in substrate through-holes.

Career Highlights

Chun-Chieh Tseng's career includes valuable experiences at the National Defense University and the Chung Cheng Institute of Technology, also affiliated with the National Defense University. His tenure at these institutions reflects a strong dedication to research and innovation in the field of technology and defense.

Collaborations

Tseng has had the privilege of collaborating with talented individuals such as Yuh Sung and Ming-Der Ger, enhancing the collective expertise in their research endeavors. These collaborations have contributed to the development of new technologies and methodologies in his areas of focus.

Conclusion

Chun-Chieh Tseng stands out as a pivotal figure in the realm of innovation, specifically with his advancements in metal pattern formation on substrates. His patents illustrate a forward-thinking approach that merges chemistry and materials science, promising to influence various technological applications in the future.