National Defense University

Chung Cheng Institute of Technology, National Defense University

Chun-Chieh Tseng

Ming-Der Ger

Yuh Sung

Chang-Ping Chang

Wen-Ding Chen

Jinn-Luh Ou

A method for forming a metal pattern on a substrate via printing and electroless plating is disclosed, which includes printing a pattern on the substrate with an ink composition, drying the printed pattern, and contacting the dried pattern with an electroless plating solution. The ink composition either contains components (i), (ii) and (iii), components (i) and (iv), or components (i) and (v), which are dissolved or dispersed in a solvent, wherein (i) is a binder; (ii) is a sulfate terminated polymer of an ethylenically unsaturated monomer; (iii) is a catalytic metal precursor; (iv) is a polymer of an ethylenically unsaturated monomer deposited with particles of catalytic metal; and (v) is a copolymer of an ethylenically unsaturated monomer and a hydrophilic monomer deposited with particles of catalytic metal. The binder (i) is a water swellable resin. The catalytic metal may be Au, Ag, Pd, Pt or Ru.

Method for forming a metal pattern on a substrate

A copolymer deposited with particles of catalytic metal is disclosed in the present invention, which is formed from an ethylenically unsaturated monomer and a hydrophilic monomer, and the catalytic metal is Au, Ag, Pd, Pt or Ru. The copolymer is hydrophilic when the temperature is lower than a specific temperature, and will become hydrophobic when the temperature is greater than the specific temperature. The present invention also discloses a method for forming a metal layer on a substrate via electroless plating, which includes contacting the substrate with an ink composition, drying the ink composition on the substrate, and contacting the dried ink composition with an electroless plating solution, wherein the ink composition contains the copolymer of the present invention in an aqueous phase. The present invention further discloses a method for forming metal conductors in through holes of a substrate.

Metallization on a surface and in through-holes of a substrate and a catalyst used therein

A process for preparing a metal styrene polymer composite having nano metallic particles deposited thereon is disclosed, which includes a) undergoing free radical polymerization of styrene and an optional co-monomer in the presence of a persulfate initiator and a chain transfer agent; and b) contacting the resulting styrene oligomer or copolymer of styrene and the co-monomer from step a) with an aqueous solution containing a noble metal ion dissolved therein, so that the noble metal ion is reduced to element form particles and deposit on the styrene oligomer or copolymer of styrene and the co-monomer by sulfates on the oligomer or copolymer in the absence of a reducing agent.

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Taoyuan, Taiwan

Chun-Chieh Tseng