Chun-Chieh Chin

Title: Innovations by Chun-Chieh Chin in LED Packaging Technology.

Introduction

Chun-Chieh Chin is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of light-emitting diode (LED) technology. His innovative approach to manufacturing package components for LEDs has garnered attention in the industry.

Latest Patents

Chin holds a patent for a "Method of manufacturing package component for light emitting diode and package structure thereof." This patent describes a method where at least one LED is placed on a substrate within a photocuring resin. The LED is entirely covered by the substrate and the resin. Power is supplied to the LED, causing it to emit multiple light beams. These beams cure a portion of the photocuring resin, resulting in a male mold. A separation process is then conducted to detach the male mold from the remaining resin, LED, and substrate. Subsequently, a rollover process is utilized to create a female mold that mirrors the male mold's shape. Finally, a forming process is executed to produce a package component that matches the male mold's design. This innovative method enhances the efficiency and effectiveness of LED packaging.

Career Highlights

Chun-Chieh Chin is associated with Genesis Photonics Inc., a company known for its advancements in photonics technology. His work at Genesis Photonics has allowed him to focus on developing cutting-edge solutions in LED packaging.

Collaborations

Chin collaborates with talented individuals such as Cheng-Yen Chen and Yun-Li Li. Their combined expertise contributes to the innovative projects at Genesis Photonics Inc.

Conclusion

Chun-Chieh Chin's contributions to LED packaging technology exemplify the importance of innovation in the field. His patent and work at Genesis Photonics Inc. highlight his role as a key player in advancing LED technology.