The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 2015

Filed:

Oct. 09, 2014
Applicant:

Genesis Photonics Inc., Tainan, TW;

Inventors:

Cheng-Yen Chen, New Taipei, TW;

Chun-Chieh Chin, Tainan, TW;

Yun-Li Li, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/52 (2010.01); H01L 33/50 (2010.01); H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01); H01L 33/56 (2010.01); H01L 31/0203 (2014.01); H01L 51/52 (2006.01); F21K 99/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/52 (2013.01); H01L 33/005 (2013.01); H01L 33/48 (2013.01); H01L 33/483 (2013.01); H01L 33/50 (2013.01); H01L 33/501 (2013.01); H01L 33/505 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); F21K 9/90 (2013.01); H01L 31/0203 (2013.01); H01L 51/5237 (2013.01);
Abstract

A method of manufacturing package component for light emitting diode (LED) is disclosed. At least one LED is disposed on a substrate inside a photocuring resin, wherein the LED is covered completely by the substrate and the photocuring resin. Power is provided to the LED to make the LED emit plural light beams such that a portion of the photocuring resin is cured by the light beams to obtain a male mold. A separation process is performed to separate the male mold and the other portion of the photocuring resin, the LED and the substrate. A rollover process is performed to manufacture the female mold by the male mold, wherein the female mold has at least one accommodation space with a shape identical to that of the male mold. A forming process is performed to form a package component with a shape identical to that of the male mold.


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