Tainan, Taiwan

Chun-Chia Yeh

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: National Cheng-Kung University. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Chia Yeh. Retrieved from https://idiyas.com/inventor/chun-chia-yeh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Innovations of Chun-Chia Yeh

Introduction

Chun-Chia Yeh is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of coating technologies. His innovative approach has led to the development of a unique wet coating method.

Latest Patents

Chun-Chia Yeh holds 1 patent for his invention titled "Wet Coating Method." This method involves applying a film coating to at least one surface of a substrate using a wet process. Following this, a plasma-assisted filling treatment is performed on the film coating to crystallize it into a solid film. The treatment includes the use of a filling coating, enhancing the overall quality and durability of the coating.

Career Highlights

Chun-Chia Yeh is affiliated with National Cheng-Kung University, where he contributes to research and development in innovative coating methods. His work is recognized for its potential applications in various industries, including electronics and materials science.

Collaborations

Chun-Chia Yeh has collaborated with esteemed colleagues such as Chau-Nan Hong and Hsiang-En Hsu. Their joint efforts have further advanced the research in coating technologies.

Conclusion

Chun-Chia Yeh's contributions to the field of wet coating methods exemplify the importance of innovation in technology. His work not only enhances existing processes but also paves the way for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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