Chun-Chi Hsu

Title: Innovations of Chun-Chi Hsu in LED Technology

Introduction

Chun-Chi Hsu is a notable inventor based in Hsinchu Hsien, Taiwan. He has made significant contributions to the field of LED technology, particularly in the area of wafer-level packaging processes. His innovative work has led to the development of a unique composite film that enhances the efficiency of LED manufacturing.

Latest Patents

Chun-Chi Hsu holds 1 patent for his invention titled "Composite film for use in LED wafer-level packaging process." This patent introduces a composite film designed to facilitate the adhesion of an LED wafer to a carrier. The film includes a substrate with a heat-resisting pressure-sensing adhesive on one side, allowing the LED wafer to adhere securely. On the opposite side, a heat-resisting thermally-visbreaking pressure-sensing adhesive is used, which reduces its adhesiveness strength during the heating process. This innovative design allows for easy detachment of the carrier from the composite film after the packaging process is completed.

Career Highlights

Chun-Chi Hsu is associated with Taimide Technology Incorporation, where he has been instrumental in advancing LED packaging technologies. His work has not only contributed to the efficiency of manufacturing processes but has also enhanced the overall performance of LED products in the market.

Collaborations

Chun-Chi Hsu has collaborated with notable colleagues, including Chun-Ting Lai and Chih-Wei Lin. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies in the field of LED manufacturing.

Conclusion

Chun-Chi Hsu's contributions to LED technology through his innovative patent demonstrate his commitment to advancing the industry. His work at Taimide Technology Incorporation continues to influence the future of LED packaging processes.