Company Filing History:
Years Active: 2019-2022
Title: Innovations of Chun-Cheng Kuo
Introduction
Chun-Cheng Kuo is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing semiconductor device structures and manufacturing methods.
Latest Patents
One of his latest patents is titled "Semiconductor device structure having stiffener with two or more contact points for heat dissipating element." This patent describes a semiconductor device structure that includes a substrate, a die, and a stiffener. The stiffener surrounds the die and is designed to improve heat dissipation. The structure features a first upper surface adjacent to the die and a second upper surface that is farther away, with specific distances that optimize performance.
Another significant patent is "Package structure and method for manufacturing the same." This patent outlines a package structure that includes a wiring structure along with two electronic devices placed side by side. The design ensures that there is a gap of at least 150 micrometers between the two devices, which is crucial for their effective operation.
Career Highlights
Chun-Cheng Kuo is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor technologies. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.
Collaborations
He collaborates with talented coworkers such as Yu-Hsiang Chao and Jun-Chieh Wu, contributing to a dynamic team focused on cutting-edge semiconductor research and development.
Conclusion
Chun-Cheng Kuo's contributions to semiconductor technology through his patents and work at Advanced Semiconductor Engineering, Inc. highlight his role as a key innovator in the field. His inventions are paving the way for advancements in electronic device performance and efficiency.