Chul Hyun Park

USPTO Granted Patents = 18 (Patent Applications = 4)

Average Co-Inventor Count = 3.3

ph-index = 4

Forward Citations = 63(Granted Patents)

Location History:

Seoul, KR (2015 - 2021)
Icheon-si, KR (2014 - 2022)

Company Filing History:

Samsung Electronics Co., Ltd.

patents

4. 1 out of 2,607

Korea Advanced Institute of Science and Technology

patents

where one patent can have more than one assignee

Years Active: 2014-2022

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18 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11315905 - Semiconductor packages including a bonding wire branch structure (2022-04-26),

2. 11025611 - Method and apparatus of constructing secure infra-structure for using embedded universal integrated circuit card (2021-06-01),

3. 10637822 - Method and device for managing identifier of EUICC (2020-04-28),

4. 10462667 - Method of providing mobile communication provider information and device for performing the same (2019-10-29),

5. 10334443 - Method for configuring profile of subscriber authenticating module embedded and installed in terminal device, and apparatus using same (2019-06-25),

6. 10187798 - Terminal device having subscriber identity device and method for selecting profile thereof (2019-01-22),

7. 10111092 - Terminal device having subscriber identity device and method for selecting profile thereof (2018-10-23),

8. 9924357 - Method for providing mobile communication provider information and device for performing same (2018-03-20),

9. 9706407 - Method for configuring profile of subscriber authenticating module embedded and installed in terminal device, and apparatus using same (2017-07-11),

10. 9678994 - Method of backing up profile and apparatus therefor (2017-06-13),

11. 9585000 - Method of providing subscriber profile of eUICC based on change of network (2017-02-28),

12. 9467187 - Method for selecting mobile communication network provider using provisioning profile, and apparatus using same (2016-10-11),

13. 9264844 - Method and apparatus of providing SIM profile for embedded universal integrated circuit card (2016-02-16),

14. 9231931 - Method and apparatus of constructing secure infra-structure for using embedded universal integrated circuit card (2016-01-05),

15. 9204300 - Method for providing SIM profile in eUICC environment and devices therefor (2015-12-01),

Title: Chul Hyun Park: Innovator in Semiconductor Technology

Introduction

Chul Hyun Park is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 18 patents. His innovative work has advanced the capabilities of semiconductor packages and secure communication methods.

Latest Patents

One of his latest patents involves semiconductor packages that include a bonding wire branch structure. This semiconductor package features a package substrate, a die stack with a first and second sub-stack part, an interface chip, and a bonding wire structure. The bonding wire structure connects various die pads and facilitates communication with the interface chip. Another notable patent is a method and apparatus for constructing secure infrastructure using an embedded universal integrated circuit card (eUICC). This method outlines the process for creating a secure link between a requesting entity and a responding entity, ensuring secure communication through shared keys.

Career Highlights

Chul Hyun Park has worked with notable companies such as KT Corporation and SK Hynix Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

He has collaborated with talented individuals in the field, including Kwan Lae Kim and Jin Hyoung Lee. Their combined expertise has contributed to the successful development of various technologies.

Conclusion

Chul Hyun Park's contributions to semiconductor technology and secure communication methods highlight his role as a leading inventor in the industry. His patents reflect a commitment to innovation and advancement in technology.

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4 patents pending:

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