Hong Kong, China

Chujie Tan

This inventor holds 1 USPTO granted patent. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chujie Tan. Retrieved from https://idiyas.com/inventor/chujie-tan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Chujie Tan and His Patent for a Cooled Bond Head Heater.

Introduction

Chujie Tan is an inventor associated with Hong Kong, CN. His patent work addresses thermal management in semiconductor die-bonding equipment.

Latest Patents

The provided information lists one patent for Tan: Bond Head Heater Incorporating Fluid Chamber for Cooling. The invention describes a cooling system for a bond head heater with a heater plate that heats a die held nearby. A fluid chamber is thermally coupled to the heater plate and includes an enclosure, an inlet, and an outlet. Fluid flows through a heat-transmission path substantially next to the heater plate, entering through the inlet and leaving through the outlet to carry heat away. Tan’s listed patent portfolio includes 1 patent.

Career Highlights

Tan’s listed invention focuses on integrating fluid-based cooling with a bond head heater. By directing fluid along a path close to the heater plate, the design aims to manage heat while the plate performs its heating function.

Collaborations

The provided information identifies Man Lee and Cheuk Wah Tang as Tan’s coworkers. No further details about their roles or specific contributions to the patent are provided.

Conclusion

Chujie Tan’s listed patent presents a fluid-chamber cooling approach for bond head heaters, highlighting his contribution to thermal management in die-bonding equipment.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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