Suwon, South Korea

Chui Ho Lee

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Sdi Co., Inc.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chui Ho Lee. Retrieved from https://idiyas.com/inventor/chui-ho-lee-x37b2mlc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Innovations by Chui Ho Lee in Semiconductor Technology

Introduction

Chui Ho Lee is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to epoxy resin compositions.

Latest Patents

Chui Ho Lee holds a patent for an "Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same." This invention involves an epoxy resin composition designed for the encapsulation of semiconductor devices. The composition includes an epoxy resin, a curing agent, an inorganic filler, and a curing catalyst. The epoxy resin is represented by a specific formula, enhancing the performance and reliability of semiconductor devices.

Career Highlights

Chui Ho Lee is currently employed at Samsung SDI Co., Inc., where he continues to work on advancements in semiconductor technology. His expertise and innovative approach have positioned him as a valuable asset in the industry.

Collaborations

Chui Ho Lee collaborates with talented colleagues, including Yong Jong Park and Dong Hwan Lee, who contribute to the development of cutting-edge technologies in their field.

Conclusion

Chui Ho Lee's work in developing epoxy resin compositions for semiconductor devices showcases his innovative spirit and dedication to advancing technology. His contributions are vital to the ongoing evolution of semiconductor encapsulation methods.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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