Harbin, China

Chuanying Ren

This inventor holds 1 USPTO granted patent. Top assignee: Institute of Food Processing, Haas. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chuanying Ren. Retrieved from https://idiyas.com/inventor/chuanying-ren

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Chuanying Ren and Microwave-Induced Cracking for Easy-to-Cook Whole Grains.

Introduction

Chuanying Ren is an inventor associated with Harbin, China, and the Institute of Food Processing, Haas. His work includes a food-processing invention designed to make whole grains easier to cook while retaining their complete-grain form.

Latest Patents

Ren is listed as an inventor on 1 patent: “Preparation Method of Easy-to-Cook Whole Grain Based on Microwave-Induced Cracking.” The method applies heat-moisture treatment to whole grains, followed by short-time microwave-induced cracking, tempering, and cooling. The resulting grains remain intact, expand slightly, and develop fine surface cracks. During steaming, their water absorption increases from 1.35 times to 1.9 times the original weight of unprocessed whole grains.

Career Highlights

The patent reflects Ren’s work in food processing, particularly in developing a preparation method that improves the cooking properties of whole grains. The disclosed process uses controlled treatment and microwave-induced cracking to increase water absorption while preserving the grains’ overall structure.

Collaborations

Shuwen Lu and Bin Hong are identified as Ren’s coworkers. They are associated with the same food-processing research context.

Conclusion

Chuanying Ren’s patent presents a microwave-based approach to preparing whole grains that absorb more water during steaming while retaining their complete form.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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