This inventor holds 1 USPTO granted patent. Top assignee: National Center for Advanced Package. Active years: 2021.
Company Filing History:
Years Active: 2021
Title: Innovations by Chuanguo Dou in Stress Sensor Technology.
Introduction
Chuanguo Dou is a notable inventor based in Wuxi, China. He has made significant contributions to the field of sensor technology, particularly in the development of stress sensors. His innovative work has led to the creation of a unique stress sensor structure that has practical applications in various industries.
Latest Patents
Chuanguo Dou holds a patent for a "Stress sensor structure and a manufacturing method thereof." This invention discloses a stress sensor structure that includes a substrate with a blind-hole on its first surface. The structure features a first and second piezoresistive layer, which are formed by materials exhibiting piezoresistive effects. These layers are interconnected at their bottom portions and separated by a second insulating layer. The sensor is designed to measure stress, particularly axial stress, in a Through-Silicon Via (TSV) structure by applying an external voltage between two electrodes.
Career Highlights
Chuanguo Dou is associated with the National Center for Advanced Package, where he continues to work on innovative technologies. His expertise in sensor design and manufacturing has positioned him as a key figure in advancing stress measurement technologies.
Collaborations
He has collaborated with notable colleagues, including Wen Yin and Heng Yang, contributing to the development of advanced sensor technologies.
Conclusion
Chuanguo Dou's work in stress sensor technology exemplifies the innovative spirit of modern inventors. His contributions are paving the way for advancements in sensor applications across various fields.