Chuan Hu

Title: Chuan Hu: Innovator in Radio Frequency Module Packaging

Introduction

Chuan Hu is a prominent inventor based in Guangdong, China, known for his contributions to the field of semiconductor technology. With a total of five patents to his name, he has made significant advancements in radio frequency module packaging structures and manufacturing methods.

Latest Patents

Chuan Hu's latest patents include a filter radio frequency module packaging structure and a method for manufacturing the same. This invention discloses a first filter chip that comprises a chip main body and a wall structure. The wall structure, functional surface, and substrate together define a closed cavity, or alternatively, the wall structure and functional surface define a closed cavity. An encapsulation material wraps the first filter chip, enhancing its functionality and durability.

Another notable patent is the chip interconnection package structure and method. This invention involves forming a sacrificial pattern layer on a support structure, followed by the creation of an interconnection winding pattern layer on the sacrificial pattern layer. The process includes forming a first insulating layer and arranging multiple chips on this layer, ensuring they correspond to the interconnection winding pattern. The support structure is then removed, resulting in a first interconnection hole that aligns with a corresponding interconnection pin of the chip.

Career Highlights

Chuan Hu has worked with several esteemed institutions, including the Institute of Semiconductors, Guangdong Academy of Sciences, and the Guangdong Institute of Semiconductor Industrial Technology. His work in these organizations has contributed to the advancement of semiconductor technologies and innovations.

Collaborations

Chuan Hu has collaborated with notable colleagues such as Zhitao Chen and Zibai Li, further enhancing his research and development efforts in the semiconductor field.

Conclusion

Chuan Hu's innovative work in radio frequency module packaging and semiconductor technology has established him as a key figure in his field. His patents reflect a commitment to advancing technology and improving manufacturing processes.