Chuan Hu

Title: Chuan Hu - Innovator in Fan-Out Packaging Technology

Introduction

Chuan Hu is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of electronic packaging, particularly through his innovative fan-out packaging method. His work has implications for the efficiency and effectiveness of electronic component integration.

Latest Patents

Chuan Hu holds a patent for a fan-out packaging method and fan-out packaging plate. This method involves preparing circuit patterns on one or both sides of a substrate and installing electronic parts accordingly. The packaging layers, made of a thermal-plastic material, encapsulate the substrate, circuit patterns, and electronic parts. The design includes a via hole that allows communication between both sides of the substrate, enhancing the connectivity and functionality of the electronic assembly.

Career Highlights

Chuan Hu is associated with Shenzhen Xiuyi Investment Development Partnership (Limited Partnership). His role in this company has allowed him to focus on advancing packaging technologies that are crucial for modern electronics. His innovative approach has positioned him as a key figure in the industry.

Collaborations

Chuan Hu collaborates with talented individuals such as Yingqiang Yan and Yuejin Guo. Their combined expertise contributes to the development of cutting-edge technologies in electronic packaging.

Conclusion

Chuan Hu's contributions to fan-out packaging technology exemplify the importance of innovation in the electronics sector. His patent reflects a significant advancement that can enhance the performance of electronic devices.