Chuan-An Cheng

Title: The Innovative Contributions of Chuan-An Cheng

Introduction: Chuan-An Cheng is a prominent inventor based in Zhubei City, Taiwan. He has made significant strides in the field of semiconductor technology, particularly through his innovative patent that enhances device connectivity. His work is instrumental in advancing the capabilities of modern electronic devices.

Latest Patents: Chuan-An Cheng holds a patent titled "Through-dielectric vias for direct connection and method forming same." This patent describes a method that includes bonding a tier-1 device die to a carrier, forming a first gap-filling region to encapsulate the tier-1 device die, and creating a first redistribution structure that is electrically connected to the tier-1 device die. The method further involves bonding a tier-2 device die to the tier-1 device die, which extends laterally beyond the edge of the tier-1 device die. Additionally, a second gap-filling region encapsulates the tier-2 device die, and a through-dielectric via is formed, penetrating through the first gap-filling region and connecting electrically to the tier-2 device die. This innovative approach enhances the efficiency and functionality of semiconductor devices.

Career Highlights: Chuan-An Cheng is currently employed at Taiwan Semiconductor Manufacturing Co., Ltd., a leading company in the semiconductor industry. His role at this prestigious organization allows him to contribute to cutting-edge technology and collaborate with other experts in the field.

Collaborations: One of Chuan-An Cheng's notable collaborators is Sung-Feng Yeh. Their partnership exemplifies the collaborative spirit that drives innovation in the semiconductor sector.

Conclusion: Chuan-An Cheng's contributions to semiconductor technology through his patent and work at Taiwan Semiconductor Manufacturing Co., Ltd. highlight his role as a key innovator in the industry. His advancements pave the way for future developments in electronic devices.