Singapore, Singapore

Chua Boon Beng

This inventor holds 1 USPTO granted patent. Top assignee: Pratt & Whitney Services Pte Ltd.. Active years: 2016.


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Chua Boon Beng: Innovator in Polishing Technology

Introduction

Chua Boon Beng is a notable inventor based in Singapore, SG. He has made significant contributions to the field of polishing technology, particularly through his innovative patent. His work is recognized for enhancing the efficiency and effectiveness of component polishing processes.

Latest Patents

Chua Boon Beng holds a patent for a "Polishing assembly and method for polishing using a platform and barrier in a tumbling process." This invention involves a component polishing method that protects portions of the component during the polishing process by using a barrier that is spaced from the component. The barrier is designed to move in conjunction with the component during polishing, ensuring optimal results.

Career Highlights

Chua is currently employed at Pratt & Whitney Services Pte Ltd., where he continues to develop and refine innovative technologies. His expertise in polishing methods has positioned him as a valuable asset to his company and the industry.

Collaborations

Chua has worked alongside talented colleagues, including Thomas Tan and Kim Wei Cheah, contributing to a collaborative environment that fosters innovation and creativity.

Conclusion

Chua Boon Beng's contributions to polishing technology exemplify the impact of innovation in engineering. His patent reflects a commitment to improving processes and enhancing product quality.

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