Chu Hua Goh

Title: Innovations by Inventor Chu Hua Goh

Introduction

Chu Hua Goh is a notable inventor based in Malacca, Malaysia. He has made significant contributions to the field of semiconductor technology. With a total of 2 patents, Goh's work focuses on innovative methods for fabricating semiconductor devices.

Latest Patents

One of his latest patents is titled "Semiconductor device fabricated by flux-free soldering." This method involves placing a first semiconductor chip on a carrier, ensuring that the first main surface of the chip faces the carrier. A first layer of soft solder material is introduced between the chip and the carrier, with heat applied to achieve a temperature equal to or higher than the melting temperature of the solder. A second layer of soft solder material is also utilized, with similar heating processes to ensure proper solidification.

Another significant patent is the "Electronic sensor device including a flip-chip mounted semiconductor chip and a substrate with an opening." This electronic device features a semiconductor chip with a sensor or actuator element on its main face. The design allows for the semiconductor chip to be positioned above a substrate, which includes an opening that facilitates signal passage to and from the sensor or actuator element.

Career Highlights

Chu Hua Goh is currently employed at Infineon Technologies AG, where he continues to advance his research and development in semiconductor technologies. His work has been instrumental in enhancing the efficiency and functionality of electronic devices.

Collaborations

Goh has collaborated with notable colleagues such as Matthias Steiert and Kok Yau Chua, contributing to various projects that push the boundaries of semiconductor innovation.

Conclusion

Chu Hua Goh's contributions to semiconductor technology through his patents and work at Infineon Technologies AG highlight his role as a key innovator in the field. His inventions are paving the way for advancements in electronic devices and systems.