Crolles, France

Christopher M Prindle


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: **Christopher M Prindle: Innovator in Semiconductor Technology**

Introduction

Christopher M Prindle is a distinguished inventor based in Crolles, France, known for his significant contributions to semiconductor technology. He holds one patent that showcases his innovative approach to improving the manufacturing processes in the electronics industry.

Latest Patents

Prindle's notable patent, titled "Semiconductor process and composition for forming a barrier material overlying copper," introduces an electroless plating process designed to enhance the thermal stability and compatibility of barrier materials with low k dielectric materials. This innovative process employs a plating bath of morpholine borane which, in combination with mixed chelating agents, allows for effective complexation of copper. This advancement is essential in the production of reliable copper interconnects in semiconductor wafers.

Career Highlights

Christopher M Prindle has made a name for himself in the field of semiconductor manufacturing through his tenure at Freescale Semiconductor, Inc. His work in process innovation reflects a deep understanding of material science and engineering, contributing to the growing demands of the technology sector.

Collaborations

Throughout his career, Prindle has collaborated with esteemed colleagues such as Varughese Mathew and Sam S Garcia. These partnerships have enabled the exchange of ideas and techniques, further advancing the development of semiconductor technologies.

Conclusion

Christopher M Prindle stands as a prominent figure in the realm of semiconductor innovation. His patent exemplifies a breakthrough in barrier materials for copper interconnects, marking him as a valuable contributor in the electronics industry. As technology continues to evolve, the impact of his work will likely resonate in future advancements.

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