The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2005
Filed:
Aug. 27, 2003
Varughese Mathew, Austin, TX (US);
Sam S. Garcia, Austin, TX (US);
Christopher M. Prindle, Crolles, FR;
Varughese Mathew, Austin, TX (US);
Sam S. Garcia, Austin, TX (US);
Christopher M. Prindle, Crolles, FR;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
An electroless plating process for forming a barrier film such as a cobalt tungsten boron film on copper interconnects lines of semiconductor wafers uses a plating bath of morpholine borane which provides higher thermal stability and range, allowing for greater compatibility with low k dielectric materials. Mixed chelating agents with different stability constants with a metal source are used to complex base metal such as copper which dissolves into solution, if any. A fluorosurfactant is used as a wetting agent and stabilizer.