Endicott, NY, United States of America

Christopher J Kane


Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 44(Granted Patents)


Company Filing History:


Years Active: 2000

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2 patents (USPTO):Explore Patents

Title: Christopher J Kane: Innovator in Circuit Module Technology

Introduction

Christopher J Kane is a notable inventor based in Endicott, NY (US). He has made significant contributions to the field of circuit module technology, holding a total of 2 patents. His work focuses on enhancing the compatibility and efficiency of printed wiring structures.

Latest Patents

Kane's latest patents include the "VME Eurocard Double Printed Wiring Card Host Circuit Card Circuit" and "Circuit Module Assembly." The first patent describes a dual-board host or main printed wiring structure designed to be plug-compatible with a VME or VME64X backplane. This innovation allows for the attachment of single-board host or main boards with connectors of varying dimensions and pin configurations. The design ensures that the center lines of the connectors are offset from each other, optimizing the component mounting area. The second patent elaborates on a similar dual-board structure, emphasizing the importance of the heat sink frame's thickness in relation to the connector offset on the backplane.

Career Highlights

Throughout his career, Christopher J Kane has worked with prominent organizations such as Lockheed Martin Federal Systems, Inc. and Lockheed Martin Corporation. His experience in these companies has allowed him to develop and refine his innovative ideas in circuit technology.

Collaborations

Kane has collaborated with notable coworkers, including Eugene J Urda and Jeffrey T Butler. Their combined expertise has contributed to the advancement of circuit module technology.

Conclusion

Christopher J Kane's contributions to circuit module technology through his patents and career experiences highlight his role as an influential inventor. His work continues to impact the field, showcasing the importance of innovation in engineering.

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