Christopher J Dominic

Christopher J Dominic is a notable inventor based in Santa Ana, CA (US). He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative processes that enhance the efficiency and effectiveness of semiconductor applications.

Latest Patents

One of his latest patents is titled "Process for exposing solder bumps on an underfill coated semiconductor." This process involves applying a solvent-free underfill onto a bumped semiconductor. It includes providing an underfill in a compressible state, contacting it with a compliant surface, applying sufficient pressure to expose the bumps, optionally hardening the underfill to a solid state, and finally removing the compliant surface. Another significant patent is "Adhesive wafers for die attach application." This patent describes the fabrication of a Chip Scale Package (CSP) or a stacked chip CSP using either an unsupported film adhesive or an adhesive supported on a rigid carrier, utilizing standard die attach equipment designed for paste adhesives.

Career Highlights

Christopher J Dominic is currently employed at National Starch and Chemical Investment Holding Corporation. His role at the company allows him to apply his innovative ideas and contribute to advancements in semiconductor technology.

Collaborations

He has collaborated with notable coworkers, including Xiping He and Raghunandan Chaware, who share his passion for innovation in the semiconductor field.

Conclusion

Christopher J Dominic's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in this critical field.