Company Filing History:
Years Active: 2008
Title: Christopher Herrick: Innovator in Multilayer Printed Circuit Board Technology
Introduction
Christopher Herrick is a notable inventor based in Belmont, MA (US). He has made significant contributions to the field of multilayer printed circuit boards, particularly in the area of via stub termination structures. His innovative approach addresses critical issues related to signal distortion and bandwidth in electrical interconnects.
Latest Patents
Herrick holds a patent for "Via stub termination structures and methods for making same." This patent focuses on the use of vias in multilayer printed circuit boards to route electrical interconnects between layers. The invention aims to minimize signal distortion and enhance the usable bandwidth of interconnects by incorporating impedance terminating elements. These elements can include resistors, capacitors, and inductors, which can be formed internally within the PCB or mounted on its surface.
Career Highlights
Christopher Herrick is currently employed at Sanmina-SCI Corporation, where he continues to develop innovative solutions in the electronics manufacturing sector. His work has been instrumental in advancing the technology used in printed circuit boards, making them more efficient and reliable.
Collaborations
Herrick collaborates with various professionals in his field, including his coworker Franz Gisin. Their combined expertise contributes to the ongoing development of cutting-edge technologies in the industry.
Conclusion
Christopher Herrick's contributions to multilayer printed circuit board technology exemplify the importance of innovation in the electronics sector. His patent addresses significant challenges in signal integrity and bandwidth, showcasing his commitment to advancing the field.