Houston, TX, United States of America

Christopher E Reyna

This inventor holds 1 USPTO granted patent. Top assignee: Knauf Gips Kg. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Christopher E Reyna. Retrieved from https://idiyas.com/inventor/christopher-e-reyna

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Christopher E. Reyna and His Gypsum Wallboard Mixer Invention.

Introduction

Christopher E. Reyna is an inventor associated with Houston, Texas, and Knauf Gips KG. His patent work addresses the design of equipment used in gypsum wallboard production.

Latest Patents

Reyna is credited with 1 patent, titled “Wallboard Slurry Mixer Configured for Reducing Water:Stucco Ratio.” The invention describes an agitator for a gypsum wallboard mixer. It includes a circular disc with an upper surface, a vertically extending drive shaft, and a lump ring secured to the disc. The lump ring consists of multiple spaced, adjacent arcuate segments. The design is directed toward reducing the water-to-stucco ratio in wallboard slurry.

Career Highlights

Reyna’s listed patent connects his inventive work with Knauf Gips KG, a company in the gypsum and building materials sector. The patent focuses on mixer components intended for gypsum wallboard manufacturing.

Collaborations

The provided information identifies Myung-Sik Moon and Noel G. Villarreal as Reyna’s coworkers. Their names are associated with his professional context, though no specific joint patent contribution is stated here.

Conclusion

Christopher E. Reyna’s patent describes a segmented lump-ring agitator for gypsum wallboard mixers, reflecting an engineering approach to slurry preparation and water-to-stucco ratio control.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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