This inventor holds 4 USPTO granted patents. Top assignee: Avery Dennison Corporation. Active years: 2000-2004.
Location History:
- University Hts., OH (US) (2000 - 2002)
- University Heights, OH (US) (2002)
- University Hts, OH (US) (2004)
Company Filing History:
Years Active: 2000-2004
Title: Christopher D. Meader: Innovator in Ink-Imprintable Technologies
Introduction
Christopher D. Meader is a notable inventor based in University Heights, OH (US). He has made significant contributions to the field of adhesive technologies, holding a total of 4 patents. His work primarily focuses on ink-imprintable release coatings and pressure-sensitive adhesive constructions.
Latest Patents
Meader's latest patents include innovative compositions for ink-imprintable release coatings. These compositions consist of a polymer that may include a polyurethane, a fluoroacrylate polymer or copolymer, or a silicone polymer that is either addition cured or condensation cured. The formulations also incorporate dispersed and/or emulsified resin particles, which can include polyurethanes, polyamides, and polyureas. Additionally, he has developed ink-imprintable label, tape, and stamp constructions that feature a pressure-sensitive adhesive on the back surface and a cured ink-imprintable release coating on the face surface. These constructions are designed to be used in a roll or stacked sheet configuration without an independent release liner.
Career Highlights
Christopher D. Meader is currently associated with Avery Dennison Corporation, where he continues to innovate in the field of adhesive technologies. His work has been instrumental in advancing the capabilities of ink-imprintable materials.
Collaborations
Meader has collaborated with notable colleagues such as Dong-Tsai Hseih and Wen-Chen Su, contributing to the development of cutting-edge adhesive solutions.
Conclusion
Christopher D. Meader's contributions to ink-imprintable technologies and adhesive constructions highlight his role as a leading inventor in his field. His innovative patents and collaborations continue to shape the future of adhesive applications.
