Blacklick, OH, United States of America

Christian S Wurapa

This inventor holds 2 USPTO granted patents. Top assignee: Other. Active years: 2016-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Christian S Wurapa. Retrieved from https://idiyas.com/inventor/christian-s-wurapa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.3

ph-index = 2

Forward Citations = 22(Granted Patents)


Company Filing History:

goldMedal2 out of 834,601 
Other
 patents

Years Active: 2016-2021

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Christian S Wurapa: Innovator in Adhesive Bandage Technology

Introduction

Christian S Wurapa is an accomplished inventor based in Blacklick, OH (US). She has made significant contributions to the field of medical technology, particularly in the development of adhesive bandages. With a total of 2 patents to her name, her work has the potential to improve the quality of care for patients.

Latest Patents

One of her latest patents is an innovative adhesive bandage designed specifically for fingertips. This invention addresses the unique challenges associated with treating injuries in this sensitive area, providing enhanced protection and comfort.

Career Highlights

Throughout her career, Christian has focused on creating practical solutions that meet the needs of users. Her dedication to innovation has led her to explore various aspects of adhesive technology, resulting in her successful patent applications.

Collaborations

Christian has collaborated with her coworker, Raymond K Wurapa, to further enhance her inventions and bring new ideas to fruition.

Conclusion

Christian S Wurapa's contributions to adhesive bandage technology exemplify her commitment to innovation and improving patient care. Her work continues to inspire advancements in the medical field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…