Eching, Germany

Christian Michael Herwerth

This inventor holds 1 USPTO granted patent and 3 published patent applications and 2 EPO patents. Top assignee: Linde Gmbh. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Christian Michael Herwerth. Retrieved from https://idiyas.com/inventor/christian-michael-herwerth

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Christian Michael Herwerth: Innovator in Heat Exchanger Technology.

Introduction

Christian Michael Herwerth is a notable inventor based in Eching, Germany. He has made significant contributions to the field of heat exchanger technology, particularly through his innovative designs and methods.

Latest Patents

Herwerth holds a patent for a device that facilitates directed decoupling between the bundle and core tube in wound heat exchangers. This invention relates to a device used in the production of a tube bundle for a wound heat exchanger, where tubes are wound in multiple layers onto a core tube. The design includes webs arranged between the tube layers, enhancing the efficiency of the heat exchanger.

Career Highlights

Christian Michael Herwerth is associated with Linde GmbH, a leading company in the industrial gases and engineering sector. His work at Linde has allowed him to focus on innovative solutions that improve heat exchange processes.

Collaborations

Herwerth has collaborated with notable colleagues, including Manfred Schönberger and Roland Hiller, contributing to advancements in their field.

Conclusion

Christian Michael Herwerth's contributions to heat exchanger technology through his patent and work at Linde GmbH highlight his role as an influential inventor in the industry. His innovative approach continues to impact the efficiency of heat exchangers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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