Christian Baeumler

Title: Christian Baeumler: Semiconductor Packaging Innovation

Introduction

Christian Baeumler is an inventor associated with Chemnitz, Germany, and Infineon Technologies Austria AG. His reported patent work concerns semiconductor packaging and printed circuit board designs that address magnetic coupling caused by transistor load current.

Latest Patents

Baeumler is credited with 1 patent. The patent describes a semiconductor package or printed circuit board configured to reduce, counteract, or make use of magnetic coupling generated by current flowing through a semiconductor transistor’s load path.

The disclosed package includes a transistor die with collector or drain, source or emitter, sense-source or sense-emitter, and gate terminals. It also describes a driver line and gate-control loop, along with external contacts arranged to manage magnetic coupling associated with the load current.

Career Highlights

Baeumler’s listed affiliation is Infineon Technologies Austria AG. The patent reflects work on semiconductor package and circuit-board configurations intended to address electromagnetic effects in transistor systems.

Collaborations

The supplied information names Edward Fürgut and Wolfgang Scholz as Baeumler’s coworkers. Their specific roles in the patent or related work are not provided.

Conclusion

Christian Baeumler’s reported invention focuses on managing magnetic coupling in semiconductor systems through the arrangement of package or circuit-board contacts.