Chungcheongnam-do, South Korea

Choon Sik Kim


Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2014

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2 patents (USPTO):Explore Patents

Title: Innovations of Choon Sik Kim in Substrate Processing Technology

Introduction

Choon Sik Kim is a notable inventor based in Chungcheongnam-do, South Korea. He has made significant contributions to the field of substrate processing technology, holding 2 patents that showcase his innovative approach to improving productivity in this area.

Latest Patents

His latest patents include a spin head apparatus for treating substrates and a method for transferring substrates for processing. The spin head invention features a design that supports and rotates substrates effectively. It includes a body with chuck pins that can move between supporting and waiting positions, allowing for efficient loading and unloading of substrates. The chuck pin moving unit utilizes a rotation rod and a driving member to facilitate this movement, enhancing the overall functionality of the apparatus.

The substrate processing apparatus patent comprises a main load unit, a buffer load unit, and a transfer unit. This design allows for more containers to be accommodated without increasing the footprint of the apparatus. As a result, it reduces idle time for standby substrates, thereby improving overall productivity in substrate processing.

Career Highlights

Choon Sik Kim is currently associated with Semes Co., Ltd., where he continues to develop innovative solutions in substrate processing technology. His work has been instrumental in advancing the efficiency of substrate treatment processes.

Collaborations

He collaborates with Jeong Yong Bae, contributing to the development of cutting-edge technologies in their field.

Conclusion

Choon Sik Kim's contributions to substrate processing technology through his patents reflect his commitment to innovation and efficiency. His work continues to influence the industry positively.

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