This inventor holds 1 USPTO granted patent. Top assignee: Western Digital Technologies, Inc.. Active years: 2022.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022
Title: **Inventor Choon Kuai Lee: Innovating Thermal Relief Technologies**
Introduction
Choon Kuai Lee, an accomplished inventor based in Bayan Lepas, Malaysia, holds a patent that reflects his contributions to the field of electronics. His work primarily focuses on enhancing the efficiency of multi-layer printed circuit boards (PCBs), particularly through innovative thermal relief designs.
Latest Patents
Choon Kuai Lee's notable patent, titled "Thermal relief for through-hole and surface mounting," introduces a novel approach to PCB design. The invention comprises a bonding surface on the first surface of a multi-layer PCB, alongside a first thermal relief pad that surrounds the bonding surface. This innovative structure includes a first conductive plane that partially encloses the thermal relief pad while being connected to the bonding surface via spokes. Additionally, a second thermal relief pad and a second conductive plane enhance the thermal management of the PCB, ensuring better performance and reliability for electronic components via an electrical connector that fits through a hole located in the bonding surface.
Career Highlights
Choon Kuai Lee is currently employed at Western Digital Technologies, Inc., a leading company in the storage solutions industry. His role involves applying his expertise to develop advanced technological solutions that improve product performance and efficiency.
Collaborations
Throughout his career, Choon has collaborated with skilled professionals such as Chun Sean Lau and Ing Chyuan Ooi. These partnerships have likely played a crucial role in refining his innovations and driving progress within their projects at Western Digital Technologies.
Conclusion
Choon Kuai Lee's dedication to advancing PCB technology through his innovative patent demonstrates his significant contributions to the electronics field. His work not only enhances product efficiency but also showcases the importance of creative solutions in technology. As he continues his journey at Western Digital Technologies, Lee’s contributions will undoubtedly influence future advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile